IEI logo
Search
English - Global
Choose your language
Newsroom
2020
2019
2018
Home > Newsroom > 2017
Newsroom
Media contact
IEI Integration Corp.
TEL: +886-2-8691-6798
+886-2-2690-2098
FAX: +886-2-6616-0028
IEI Technology USA
TEL: +1-909-595-2819
FAX: +1-909-595-2816
IEI Integration China
TEL: +86-21-3462-7799
FAX: +86-021-3462-7797
IEI Integration Corp. 東京支店
TEL: +81-3-5901-9735
FAX: +81-3-5901-9736
IEI New Automation System with Rich Expansion & Guaranteed Performance!
 
TANK-870-Q170
Features Guaranteed system performance
Smart Choice for Surveillance System 5V@3A or 12V@3A Internal Power Connector
Flexible Expansion Interface Fully Integrated I/O
Specifications Dimension
Ordering Information Options
Packing list
 
   Features
 
6th Gen Intel® Core™ processor platform with Intel® Q170 chipset and DDR4 memory
Triple independent display with high resolution support
Rich high-speed I/O interfaces on one side for easy installation
On-board internal power connector for providing power to add-on cards
Great flexibility for hardware expansion
 
   Guaranteed system performance
 

The TANK-870-Q170 is designed to operate in harsh factory environment with high performance. In high temperature environment, particularly, its great fan-less cooling system allows stable operation and offers highest level of failure tolerance.
 
TANK-870-Q170i-i5/4GThermal Test
Testing
point		 Test condition Spec Pass/
Fail
30°C 45°C 60°C
CPU Temperature 69°C~75°C 87°C~97°C 81°C~87°C Tj:0-100°C PASS
CPU Frequency 2989 MHz 2989 MHz 2292 MHz Tj:0-100°C PASS

 
 
   Smart Choice for Surveillance System
 
 
The TANK-870-Q170 integrated with IEI PoE Ethernet port expansion card can be used as a surveillance system
for factory and public security. IEI PoE expansion card can support up to four PoE IEEE802.3af ports (max. 15.4 W
per port) by PCIe x4.
 
 
   5V@3A or 12V@3A Internal Power Connector
 

The TANK-870-Q170 provides the most convenient 4-pin internal power connector for add-on card usage, adding more flexibility to the embedded system in industrial environment.
 
   Flexible Expansion Interface
 
Backplane TANK-870-Q170i-2A TANK-870-Q170i-2B TANK-870-Q170i-4A TANK-870-Q170i-4B
Slot Type PCIe x16 PCIe x16 PCIe x16 PCIe x16 PCIe x16 PCI
Signal PCIe x8 PCIe x16 PCIe x8 PCIe x8 PCIe x16 PCI
Slot Type PCIe x16 PCI PCI PCI PCI PCI
Signal PCIe x8 PCI PCI PCI PCI PCI
PCIe Mini N/A N/A 1 1
* The expansions described above are provided by the backplanes
 
   Fully Integrated I/O
 


 

 
   Specifications
 
Model Name TANK-870-Q170
Chassis Color Black C + Silver
Dimensions (WxDxH) 2-slot: 121.5mm x 255.2mm x 205mm
4-slot: 154.8mm x 255.2mm x 205mm
System Fan Fanless
Chassis Construction Extruded aluminum alloys
Motherboard CPU Intel® Core™ i7-6700TE (2.4 GHz, quad-core, TDP=35)
Intel® Core™ i5-6500TE (2.3 GHz, quad-core, TDP=35)
Chipset Intel® Q170
System Memory 2 x 260-pin DDR4 SO-DIMM, one 4 GB pre-installed (system max: 64GB)
IPMI iRIS Solution 1 x iRIS-2400 (optional)
Storage Hard Drive 2 x 2.5'' SATA 6Gb/s HDD/SSD bay (RAID 0/1 support)
I/O Interfaces USB 3.0 4
USB 2.0 4
Ethernet 2 x RJ-45
LAN1: Intel® I219LM PCIe controller
LAN2 (iRIS): Intel® I210 PCIe controller
COM Port 4 x RS-232 (2 x RJ-45, 2 x DB-9 w/2.5KV isolation protection)
2 x RS-232/422/485 (DB-9)
Digital I/O 8-bit digital I/O , 4-bit input / 4-bit output
Display 1 x VGA
1 x HDMI/DP
1 x iDP (optional)
Resolution VGA: Up to 1920 x 1200@60Hz
HDMI/DP: Up to 4096×2304@60Hz
Audio 1 x Line-out, 1 x Mic-in
Wireless 1 x 802.11b/g/n ( optional)
Expansions Backplane 2-slot model: 1 x PCIe x16, 1 x PCI
2-slot model: 2 x PCIe x8
4-slot model: 2 x PCIe x8, 2 x PCI, 1 x Full-size PCIe Mni
4-slot model: 1 x PCIe x16, 3 x PCI, 1 x Full-size PCIe Mni
PCIe Mini 1 x Half-size PCIe Mini slot
1 x Full-size PCIe Mini slot (supports mSATA, colay with SATA)
Power Power Input DC Jack: 9 V~36 V DC
Terminal Block: 9 V~36 V DC
Power Consumption 19 V@3.68 A (Intel® Core™ i7-6700TE with 8 GB memory)
Internal Power output 5V@3A or 12V@3A
Reliability Mounting Wall mount
Operating Temperature i7-6700TE -20°C ~ 45°C with air flow (SSD),
10% ~ 95%, non-condensing
i5-6500TE -20°C ~ 60°C with air flow (SSD),
10% ~ 95%, non-condensing
Storage Temperature -40°C ~85°C with air flow (SSD), 10% ~ 90%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 100 shocks per axis
Operating Vibration MIL-STD-810G 514.6 C-1 (with SSD)
Weight (Net/Gross) 2-slot: 4.2 kg/6.3 kg
4-slot: 4.5 kg/6.5 kg
Safety/EMC CE/FCC
OS Supported OS Microsoft® Windows® 8 Embedded,
Microsoft® Windows® Embedded Standard 7 E,
Microsoft® Windows® 10 IoT Enterprise
 
   Dimensions
 


 

 
   Ordering Information
 
Part No. Description
TANK-870-Q170i-i5/4G/2A-R10 Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by
8 expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i5/4G/2B-R10 Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by
16 & 1 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i5/4G/4A-R10 Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by
8 & 2 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i5/4G/4B-R10 Ruggedized fanless embedded system with Intel® Core i5-6500TE 2.3GHz (up to 3.3 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by
16 & 3 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i7/4G/2A-R10 Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by
8 expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i7/4G/2B-R10 Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by
16 & 1 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i7/4G/4A-R10 Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 2 x PCIe by
8 & 2 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
TANK-870-Q170i-i7/4G/4B-R10 Ruggedized fanless embedded system with Intel® Core i7-6700TE 2.4GHz (up to 3.4 GHz, Quad Core, TDP 35W), 4GB DDR4 pre-installed memory, 1 x PCIe by
16 & 3 x PCI expansion, VGA/HDMI+DP/iDP, iRIS-2400 optional, 9~36V DC, RoHS
 
   Options
 
Part No. Description
32702-000400-200-RS European power cord
63040-010120-210-RS Power adapter, FSP120-ABBN2, 9NA1205302, Active PFC, Vin:90~264VAC, 120W, plug=6.5mm, cable=1500mm, Erp (no load 0.15W), Vout:19VDC, 4-pin DIN with lock, CCL, RoHS
19Z00-000605-00-RS Fan, +12V DC, 4-pin, 40 mm x 40 mm x10 mm, 6500RPM, RoHS
iRIS-2400-R10 IPMI 2.0 adapter card with AST2400 BMC chip for DDR3 SO-DIMM socket interface
EMB-WIFI-KIT01-R11 1T1R Wi-Fi module kit for embedded system, IEEE802.11b/g/n, 1 x Wi-Fi module,
2 x RF cable, 2 x Antenna, RoHs
DP-DP-R10 DisplayPort to DisplayPort converter board (for IEI IDP connector)
DP-HDMI-R10 DisplayPort to HDMI converter board (for IEI IDP connector)
DP-LVDS-R10 DisplayPort to 24-bit dual channel LVDS converter board (for IEI IDP connector)
DP-VGA-R10 DisplayPort to VGA converter board (for IEI IDP connector)
DP-DVI-R10 DisplayPort to DVI-D converter board (for IEI IDP connector)
IPCIE-4POE-R10 PCI Express Power over Ethernet frame grabber card, 4-port 1000 Base(T),
802.3af compliant, RoHS
TANK-870-Q170-WES7E64-R10 OS Image with Windows® Embedded Standard 7 E 64-bit for TANK-870-Q170 Series, with DVD-ROM, RoHS
* The TANK-870 can support up to 40°C operating temperature when installing with the IPCIE-4POE-R10.
 
   Packing List
 
1 x Utility CD 1 x Chassis Screw
1 x One Key Recovery CD 1 x Mounting Bracket
Back